Great Component Scavenger Hunt

 

 

 

 

Find the following EEE Part commonly used in space and enter the information requested below
Suggested source to start: https://www.doeeet.com/

Microcircuit, Digital, CMOS, Radiation Hardened Microprocessor, Monolithic Silicon
Subclassification Technology: CMOS
Architecture: RISC
Operates in either RISC (Reduced Instruction Set Computer) mode or MIL-STD-1750A mode
Part number: 5962H0150202VYC
1) Manufacturer’s Part Number: ____________________
2) Manufacturer: _________________________
3) Quality level: _____________________
4) Qualification Status: ________________________
5) Certification Number: ____________________________
6) Package: __________________________________
7) What is the military operating range? ____________________________________
Generic spec. MIL-PRF-38535 L 06/12/2018 0:00:00
Detailed spec. 5962-01502 B 9/5/2007
QPL/QML: QPDSIS-38535 15-Jan-19
8) List Specific Functional & Electrical
fCLOCK [Max] (Clock Frequency [Max]): __________________
#Bits (Number of Bits): __________________
CVDD (Supply Voltage for Core): ___________________
DVDD (Supply Voltage for I/O): ___________________
MIPS (Million Instruction per Second): ___________________
9) List Specific Mechanical Data
Package Material: __________________
Finish: __________________
Package: ___________________
Package Class: ________________
#Pins (Number of Pins): _____________
Radiation: Potential Sensitivity
TNID sens.: N
ID (LDR) sens.: N
SEE sens.: Y
TID (HDR) sens.: Y
SEE Comments: CMOS & BICMOS: SEL, SEU, SEHE, SEFI, SED; BIPOLAR: SEU, SET
TNID Comments: CMOS TECHNOLOGY. Effect only exhibited by bipolar or BiCMOS devices, when equivalent proton fluence>2EXP11 p/cm2 (50 Mev)
Radiation Features: SEE
SEL (Let): 55 MeV/mg/cm2
SEU (Let): 55 MeV/mg/cm2
Generic Functional & Electrical
TJ [Max] (Junction Temperature [Max]): ______________
θJC [Max] (Thermal Resistance, Junction to Case [Max]): _______________
TSTG (Storage Temperature Range): ___________________________
PD [Max] (Power Dissipation [Max]): 600mW
ESD (Electrostatic Discharge Sensitivity): ____________________
TOP (Operating Temperature Range): -55ºC to +125ºC
VCC [Max] (Supply Voltage [Max]):________________
VCC [Min] (Supply Voltage [Min]): ________________
Radiation Features: TID & TNID
TID (LDR) Comments: CMOS TECHNOLOGY. Just devices using bipolar technology are sensitive to low dose rate effect.
TID (HDR) Comments: dose rate = 50 – 300 rads(Si)/s
Neutron Irradiation: 1.0EXP14 neutrons/cm2
TID (HDR): _________________

Getting harder: Where are the wafers fabricated?_____________________
Where are the parts packaged? ___________________________
Are they in stock?_____________________________

Are there form, fit and function alternatives?

 

 

 

 

The post Great Component Scavenger Hunt first appeared on COMPLIANT PAPERS.

Reference no: EM132069492

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